HomePhones & TabletsMobile Phone AccessoriesReplacement Parts & ToolsMechanic IBGA Max Mid-level Positioning Planting Tin Platfor
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Mechanic IBGA Max Mid-level Positioning Planting Tin Platfor

KSh 5,199
KSh 7,42730%

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+ shipping from KSh 434 to CBD - UON/Globe/Koja/River Road
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Pickup Station

Delivery Fees KSh 434
Ready for pickup between 24 May and 27 May if you place your order within the next 20hrs 19mins

Door Delivery

Delivery Fees KSh 524
Ready for delivery between 24 May and 27 May if you place your order within the next 20hrs 19mins

Return Policy

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KSh 5,199

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Product details

Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
1. Strong magnetic automatic positioning function, built-in strong magnetic adsorption, precise alignment without offset.
2. Leakage tin barrier design, equipped with a leak-proof tin tin plate, and the mobile phone motherboard is protected from damage.
3. Special grade steel mesh material, high temperature resistance of 500 degrees Celsius, no bulging, no deformation.
4. Intelligent value tin, powerful functions are integrated, easy to operate.
5. Suitable for iPhone X / XS / XS Max / 11 / 11 Pro / 11 Pro Max


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Specifications

Key Features

  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor

What’s in the box

1 x package

Specifications

  • SKU: GE840EA3H69EPNAFAMZ
  • Model: B19130OMY=SPT0607
  • Production Country: China
  • Size (L x W x H cm): 12 x 8 x 2cm
  • Weight (kg): 0.20
  • Main Material: Multi-Material

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Mechanic IBGA Max Mid-level Positioning Planting Tin Platfor

Mechanic IBGA Max Mid-level Positioning Planting Tin Platfor

KSh 5,199
KSh 7,42730%
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