Description:
1. Maximize the surface area in contact with the cooling air.
2. Can reduce the risk of hardware failure due to overheating.
3. Stamped and formed by high-quality aluminum profile, with good thermal conductivity.
4. Suitable for motherboard CPU, MOS module, transistor, power supply, electron tube, PCB power board, video memory, electrical, electronic components.
5. Back with adhesive, easy to instal.
Specifications:
Item Type: Heat Sink
Material: 6063-T5 Aluminum Profile
Package list::
10 x Big Heat Sink10 x Small Heat SinkDescription:
1. Maximize the surface area in contact with the cooling air.
2. Can reduce the risk of hardware failure due to overheating.
3. Stamped and formed by high-quality aluminum profile, with good thermal conductivity.
4. Suitable for motherboard CPU, MOS module, transistor, power supply, electron tube, PCB power board, video memory, electrical, electronic components.
5. Back with adhesive, easy to instal.
Specifications:
Item Type: Heat Sink
Material: 6063-T5 Aluminum Profile
Package list::
10 x Big Heat Sink10 x Small Heat Sink