27Pcs Universal Directly Heat BGA Reballing Net Stencils Tem

KSh 810

KSh 1,54047%

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+ shipping from KSh 127 to CBD - UON/Globe/Koja/River Road

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Product details

Description:
These stencils were made of high quality 304 stainless steel plate, the thickness of steel mesh is appropriate.
Can be heated by the hot air machine, these stencils are not easy to deform when heated.
Cooperate with ordinary air gun, the manual reballing can be carried out, no need to purchase another reballing platform.
The area of stencil is matched with the area of BGA chip, which can reduce the waste of solder ball. However, for the chip that the alignment of solder ball is uneven, or with a different spacing chips, this stencil is not applicable.
It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering.

Specificationss:
Material: 304 stainless steel
Color: as shown
Stencils

Specificationss: as the picture
Quantity: 27 PCS/Set
Weight: 60g
Package Included:
27 x Universal Stencils
Important tips:
1. Leaded solder ball melting point 183 degrees, alloy SN63PB37 (tin 63% lead 37%).
2. Unleaded solder ball melting point 217 degrees Celsius. Alloy SN96.5 ag3cu0.5 (tin 96.5% silver 3% copper 0.5%).
3. Some good solder ball and silver is normal. Melting point is normal.
4.When heated directly with the air gun. Pay attention to adjusting air gun temperature. It doesn't need too high temperature. Otherwise, will result in the deformation of the stencils.
.

Specifications

Key Features

These stencils were made of high quality 304 stainless steel plate, the thickness of steel mesh is appropriate
Can be heated by the hot air machine, these stencils are not easy to deform when heated
Cooperate with ordinary air gun, the manual reballing can be carried out, no need to purchase another reballing platform
The area of stencil is matched with the area of BGA chip, which can reduce the waste of solder ball
It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering

What’s in the box

27 x Universal Stencils
Important tips:
1. Leaded solder ball melting point 183 degrees, alloy SN63PB37 (tin 63% lead 37%).
2. Unleaded solder ball melting point 217 degrees Celsius. Alloy SN96.5 ag3cu0.5 (tin 96.5% silver 3% copper 0.5%).
3. Some good solder ball and silver is normal. Melting point is normal.
4.When heated directly with the air gun. Pay attention to adjusting air gun temperature. It doesn't need too high temperature. Otherwise, will result in the deformation of the stencils.
.