4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin BGA Direct Heat Template

KSh 1,208

KSh 1,74531%

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+ shipping from KSh 155 to CBD - UON/Globe/Koja/River Road

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4pcs full set

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Ready for pickup between 31 May and 03 June if you place your order within the next 11hrs 30mins

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Ready for delivery between 31 May and 03 June if you place your order within the next 11hrs 30mins

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Product details

4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin BGA Direct Heat Template

Feature:

These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.

Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.

High success rate of planting tin, the solder balls can be formed once when you are proficient.

Simple and convenient to use.

BGA Reballing Stencil only, other accessories demo in the picture is not included!

Specifications

Key Features

4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin BGA Direct Heat Template

Description:

100% brand new and high quality.

Feature:

These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.

Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.

High success rate of planting tin, the solder balls can be formed once when you are proficient.

Simple and convenient to use.

BGA Reballing Stencil only, other accessories demo in the picture is not included!