4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin BGA Direct Heat Template

KSh 1,342

KSh 1,74523%

In stock

+ shipping from KSh 164 to CBD - UON/Globe/Koja/River Road

0 out of 5

(No ratings available)

Variation available

4pcs full set

Promotions

Easy and safer payments via the JumiaPay App.

Report incorrect product information

Delivery & Returns

Shipped from abroad

Choose your location

Pickup Station

Delivery Fees KSh 164

Ready for pickup between 31 May and 03 June if you place your order within the next 24mins

Door Delivery

Delivery Fees KSh 254

Ready for delivery between 31 May and 03 June if you place your order within the next 24mins

Return Policy

Easy Return, Quick Refund.Details

Seller Information

Elements

58%Seller Score

11 Followers

Seller Performance

Shipping speed: Poor

Quality Score: Excellent

Customer Rating: Very Poor

Product details

4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin BGA Direct Heat Template

Description:

100% brand new and high quality.

Feature:

These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.

Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.

High success rate of planting tin, the solder balls can be formed once when you are proficient.

Simple and convenient to use.

BGA Reballing Stencil only, other accessories demo in the picture is not included!

Specifications

Key Features

Specifications:

Item Type: BGA Reballing Stencil

Material: Stainless Steel

Size: Standard Size

Color: Silver

Quantity: 4PCS

Note:

No retail package.

Transition: 1cm=10mm=0.39inch

Please allow 1-3mm error due to manual measurement. pls make sure you do not mind before you bid.

Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!

Package Includes:

4 x BGA Reballing Stencils