Home Phones & Tablets Mobile Phone Accessories Cases & Clips Belt Clips & Holsters4PCS Universal BGA Stencil For MTK MSM Samsung Huawei Xiaomi IPad CPU RAM PM Power IC Reball Pin BGA Direct Heat Template

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4PCS Universal BGA Stencil For MTK MSM Samsung Huawei Xiaomi IPad CPU RAM PM Power IC Reball Pin BGA Direct Heat Template

KSh 2,513

KSh 4,17740%

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+ shipping from KSh 246 to CBD - UON/Globe/Koja/River Road

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Full set--4pcs

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Pickup Station

Delivery Fees KSh 246

Ready for pickup between 13 June and 16 June if you place your order within the next 14hrs 58mins

Door Delivery

Delivery Fees KSh 336

Ready for delivery between 13 June and 16 June if you place your order within the next 14hrs 58mins

Return Policy

Easy Return, Quick Refund.Details

Seller Information

Neimu

66%Seller Score

1 Followers

Seller Performance

Shipping speed: Very Poor

Quality Score: Excellent

Product details

Specifications

Key Features

4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin BGA Direct Heat Template

What’s in the box

1x packages

Specifications

SKU: GE840EA5GJO7YNAFAMZ
Model: phone case
Production Country: China
Size (L x W x H cm): 20x10x20
Weight (kg): 0.4

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