4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template

KSh 778

KSh 1,55650%

7 units left

+ shipping from KSh 144 to CBD - UON/Globe/Koja/River Road

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Delivery Fees KSh 144

Ready for pickup between 09 June and 11 June if you place your order within the next 4hrs 13mins

Door Delivery

Delivery Fees KSh 254

Ready for delivery between 09 June and 11 June if you place your order within the next 4hrs 13mins

Return Policy

Easy Return, Quick Refund.Details

Seller Information

flowerrain

64%Seller Score

20 Followers

Seller Performance

Shipping speed: Good

Quality Score: Very Poor

Customer Rating: Excellent

Product details

100% brand new and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.

Item Type: BGA Reballing Stencil
Colour: silver
Material: stainless steel

Package Contents:
4 x BGA Reballing Stencils

Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.