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•No-Clean Formula – Leaves minimal residue, eliminating the need for post-solder cleaning in most applications.
•High Tackiness – Holds components firmly in place during placement and reflow, ensuring accurate alignment.
•Excellent Wetting Performance – Promotes smooth and consistent solder flow for stronger, cleaner joints.
•Thermally Stable – Designed to perform reliably under high-temperature reflow and rework environments.
•Versatile Application – Suitable for BGA reballing, SMD/SMT soldering, PCB rework, repair, and assembly.
•Professional-Grade Consistency – Smooth, easy-to-apply paste that works perfectly with syringes, stencils, or manual application.
•No-Clean Formula
•High Tackiness
•Excellent Wetting Performance
•Thermally Stable
•Versatile Application
•Professional-Grade Consistency
Amtech NC 223 ASM Tacky Paste solder flux.
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