Description:
1. COMPREHENSIVE MOTION SENSING CAPABILITY: Integrated 3 axis gyroscope, 3 axis accelerometer, and 3 axis magnetic field sensor accurately capture a full range of motion changes, including rotation, acceleration, and direction.
2. HIGH ACCURACY, PROGRAMMABILITY: Gyroscope Description programmable full range rates (±250 DPS, ±500 DPS, ±1000 DPS, and ±2000 DPS), and accelerometer has selectable ±2 g, ±4 g, ±8 g, and ±16 g ranges, as well as a wide range of magnetic field measurements up to ±4900 μT, ensuring accuracy and flexibility in a wide variety of application environments.
3. BUILT IN DIGITAL DIGITAL MOTION PROCESSOR (DMP): Provides advanced data processing functions that reduce the load on the main processor for more efficient data analysis and real‑time motion detection.
4. INTEGRATED INTEGRATED TEMPERATURE SENSOR: Provides ambient temperature data and helps calibrate and compensate for motion data, enhancing overall system reliability.
5. ADVANCED MEMS PACKAGE TECHNOLOGY: The use of wafer level hermetic sealing and bonding technology can effectively improve the stability and durability of the sensor.
Specifications:
Item Type: MEMS Motion Tracking Sensor Module
Material: PCB
3 Axis Gyroscope: Programmable FSR +250 DPS, +500 DPS, +250 DPS And +2000 DPS
3 Axis Accelerometer: Programmable FSR ±2g, ±4g, ±8g And ±16g
3 Axis Magnetic Field: Wide Range To ±4900μt
Description: On Board Digital Motion Processor (DMP). Auxiliary I2C Interface For External Sensors. On Chip 16 Bit ADC And Programmable Filters. 7 MHz SPI Or 400 kHz Fast Mode I Square C. Digital Output Temperature Sensor. MEMS Structure Hermetically Sealed And Bonded At Wafer Level. Support For Android..
Package list::
1 x
MEMS Motion Tracking Sensor Module1 x Pin