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MaAnt SMD BGA Reballing Solder Paste

KSh 1,400

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Ready for pickup between 22 May and 24 May if you place your order within the next 5hrs 31mins

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Ready for delivery between 22 May and 24 May if you place your order within the next 5hrs 31mins

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Product details

Solder paste is a complex system that is made of a paste of solder powder, flux, and other additives. At the normal temperature, the solder tin paste has a certain viscosity, and the electronic component can be initially adhered to a predetermined position.
At the soldering temperature, the soldered component and the printed circuit pad are soldered together(Permanent connection) with the evaporation of the solvent and some additives. Its perfect soldering SMD components in reflow oven or with hot air soldering station.

It is suitable for Mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.

Melting Point: 183 Degree Celcius
Alloy: Sn/Pb/Ag0.4
Microns: 20-38um,
weight: 50g

Specifications

Key Features

  • Suitable for repair work
  • Strong solder bond
  • Has different alloys for better work
  • Can be used in a variety of electronic components

What’s in the box

MaAnt 183℃ SMD BGA Reballing Solder Paste

Specifications

  • SKU: GE840IP3D3X6JNAFAMZ
  • Weight (kg): 0.05

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Verified Ratings (2)

5/5
5 out of 5

2 verified ratings

Product Reviews (1)

5 out of 5

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The product is ok. It makes work easier.

23-09-2024by Lucas
Verified Purchase
MaAnt SMD BGA Reballing Solder Paste

MaAnt SMD BGA Reballing Solder Paste

KSh 1,400
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