HomePhones & TabletsMobile Phone AccessoriesReplacement PartsMainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform For IPhone 11 11 Pro
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Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform For IPhone 11 11 Pro

KSh 2,793
KSh 4,00630%

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+ shipping from KSh 266 to CBD - UON/Globe/Koja/River Road
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Pickup Station

Delivery Fees KSh 266
Ready for pickup between 13 June and 16 June if you place your order within the next 15hrs 25mins

Door Delivery

Delivery Fees KSh 356
Ready for delivery between 13 June and 16 June if you place your order within the next 15hrs 25mins

Return Policy

Easy Return, Quick Refund.Details

Seller Information

yajing

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Shipping speed: Poor

Quality Score: Excellent

Customer Rating: Average

Product details

1. Strong magnetic adsorption, simple operation
2. Fast and convenient soldering
3. High temperature resistance and easy heat dissipation
4. Pewter can be planted accurately at mesh position
5. No damage to the motherboard, accurate positionin

Specifications

Key Features

  • phone repair tool
  • BGA Repair Tools
  • phone repair tool
  • BGA Repair Tools
  • phone repair tool
  • BGA Repair Tools

What’s in the box

Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro

Specifications

  • SKU: GE840EA3FU3CINAFAMZ
  • Model: SPT0031
  • Weight (kg): 0.13

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Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform For IPhone 11  11 Pro

Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform For IPhone 11 11 Pro

KSh 2,793
KSh 4,00630%
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