Mijing IPH-13 0.12mm BGA Reballing Stencil Planting For IPhone 11 / 11 Pro / 11 Pro Max

1. Not easy to deform, prevent heating and bulging accurate hole position, one-time molding

2. Good toughness

3. High temperature resistance

4. 0.12mm, make phone repairs easier, make reballing work easier.

5. Heated anti-drum design

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