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HomeHome & OfficeTools & Home ImprovementWelding & SolderingSoldering & Brazing EquipmentSolder & FluxSoldering FluxSolder Paste BGA Solder Paste for Phone Repair Electronics Welding Flux
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KSh 1,994
KSh 3,88849%
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+ shipping from KSh 90 to CBD - UON/Globe/Koja/River Road
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Delivery Fees KSh 90
Ready for pickup between 16 January and 19 January if you place your order within the next 20hrs 50mins
Door Delivery
Delivery Fees KSh 200
Ready for delivery between 16 January and 19 January if you place your order within the next 20hrs 50mins
Return Policy
Easy Return, Quick Refund.Details
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Product details
BGA solder paste is a type of solder used for attaching components with a Ball Grid Array configuration to printed circuit boards (PCBs). This paste achieve the desired electrical and mechanical connections without the associated health and environmental risks.
Environmental Compliance: This solder paste complies with global environmental standards making it safe for both manufacturers and end-users.
Thermal Performance: Despite having a higher melting point, BGA paste provides excellent thermal performance and stability, essential for high-reliability applications like smartphone repair.
Specifications
Key Features
- Environmental Compliance
- Thermal Performance
- Stability
- Reliability
What’s in the box
BGA Solder Paste
Specifications
- SKU: GE840IP4YYJU6NAFAMZ
- Weight (kg): 0.5
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Solder Paste BGA Solder Paste for Phone Repair Electronics Welding Flux
KSh 1,994
KSh 3,88849%
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