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Thermal Compound Thermal Paste Large Needle For CPU VGA LED Chipset

KSh 367
KSh 70048%

In stock

+ shipping from KSh 70 to CBD - UON/Globe/Koja/River Road
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Pickup Station

Delivery Fees KSh 70
Ready for pickup between 13 May and 15 May if you place your order within the next 9hrs 32mins

Door Delivery

Delivery Fees KSh 160
Ready for delivery between 13 May and 15 May if you place your order within the next 9hrs 32mins

Return Policy

Easy Return, Quick Refund.Details

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Seller Information

PRISCOM COMPUTERS

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Product details

Features:

  • High-Performance Compound: HM501 Heat Sink Compound is a thermal paste designed for efficient heat transfer from CPUs, GPUs, and other electronic components.
  • Wide Application: Suitable for use with LED lights, CPU fans, and various heat-dissipating devices, ensuring optimal thermal management.
  • Reliable Thermal Conductivity: With its advanced formulation, this heat sink grease provides excellent thermal conductivity, effectively dissipating heat and prolonging the lifespan of your electronics.
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  • Easy Application: The smooth, non-curing consistency of the thermal paste allows for easy application and even distribution on heat sink surfaces.
  • Convenient Packaging: Comes in 15g pack of 4 bottle, providing a sufficient amount of thermal paste for multiple applications or replacements.
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Specifications

Key Features

  • Will help your electrical appliances improve conductivity
     
  •  enhance heat dissipation with the heatsink and fan components..
     
  • This will improve cooling of your CPU as well as GPU processors
  • Improves the performance stability by regulating heat. Better conductivity means better cooling.

What’s in the box

1 x Thermal Compound Thermal Paste

Specifications

  • SKU: GE840EA55ZI5DNAFAMZ
  • Weight (kg): 0.05

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Thermal Compound Thermal Paste Large Needle For CPU VGA LED Chipset

Thermal Compound Thermal Paste Large Needle For CPU VGA LED Chipset

KSh 367
KSh 70048%
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