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HomeComputingComputer AccessoriesThermal Paste, 5.5g CPU Paste Thermal Compound Paste Heatsink for IC/Processor/CPU/All Coolers, Carbon Based High Performance
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Thermal Paste, 5.5g CPU Paste Thermal Compound Paste Heatsink for IC/Processor/CPU/All Coolers, Carbon Based High Performance
KSh 450
KSh 1,00055%
In stock
+ shipping from KSh 70 to CBD - UON/Globe/Koja/River Road
SAFETY APPLICATION: BSFF is metal-free and non-conductive, which eliminates any risk of short circuit and adds more protection to the CPU and VGA card.
BETTER THAN LIQUID METAL: It is made of carbon microparticles, guaranteeing extremely high thermal conductivity. This ensures that heat from the CPU/GPU is dissipated quickly & efficiently.
HIGH DURABILITY: BSFF thermal paste Edition formula has excellent component heat dissipation performance and has the stability to push the system to the limit.
EXCELLENT PERFORMANCE: In contrast to metal and silicon thermal conductive adhesives, BSFF thermal paste will not compromise over time. After applying, you do not need to apply again because it will last at least 5 years.
EASY TO APPLY: BSFF thermal paste has ideal consistency and is very easy to use even for beginners
Specifications
Key Features
Type - silicone fluid Physical form - grease like
Primary use - Thermal Coupling of electronic
Special Properties - High conductivity ; low bleed;