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Thermal Paste, 5.5g CPU Paste Thermal Compound Paste Heatsink for IC/Processor/CPU/All Coolers, Carbon Based High Performance

KSh 400
KSh 1,00060%

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+ shipping from KSh 90 to CBD - UON/Globe/Koja/River Road
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Delivery Fees KSh 90
Ready for pickup between 26 November and 28 November if you place your order within the next 4hrs 12mins

Door Delivery

Delivery Fees KSh 200
Ready for delivery between 26 November and 28 November if you place your order within the next 4hrs 12mins

Return Policy

Easy Return, Quick Refund.Details

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Product details

  • SAFETY APPLICATION: BSFF is metal-free and non-conductive, which eliminates any risk of short circuit and adds more protection to the CPU and VGA card.
  • BETTER THAN LIQUID METAL: It is made of carbon microparticles, guaranteeing extremely high thermal conductivity. This ensures that heat from the CPU/GPU is dissipated quickly & efficiently.
  • HIGH DURABILITY: BSFF thermal paste Edition formula has excellent component heat dissipation performance and has the stability to push the system to the limit.
  • EXCELLENT PERFORMANCE: In contrast to metal and silicon thermal conductive adhesives, BSFF thermal paste will not compromise over time. After applying, you do not need to apply again because it will last at least 5 years.
  • EASY TO APPLY: BSFF thermal paste has ideal consistency and is very easy to use even for beginners

Specifications

Key Features

  • Type - silicone fluid Physical form - grease like
  • Primary use - Thermal Coupling of electronic
  • Special Properties - High conductivity ; low bleed; 
  • stable at high temperatures
  • Thermal Conductivity:> 1.93W/ m-k
  • Thermal resistance:> 0.225

Specifications

  • SKU: GE840CA5WRVCUNAFAMZ
  • Weight (kg): 0.0001

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Thermal Paste, 5.5g CPU Paste Thermal Compound Paste Heatsink for IC/Processor/CPU/All Coolers, Carbon Based High Performance

Thermal Paste, 5.5g CPU Paste Thermal Compound Paste Heatsink for IC/Processor/CPU/All Coolers, Carbon Based High Performance

KSh 400
KSh 1,00060%
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