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Solder Paste BGA Solder Paste for Phone Repair Electronics Welding Flux

KSh 1,994

KSh 3,88849%

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+ shipping from KSh 90 to CBD - UON/Globe/Koja/River Road

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Delivery Fees KSh 90

Ready for pickup between 29 April and 01 May if you place your order within the next 1hrs 3mins

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Product details

BGA solder paste is a type of solder used for attaching components with a Ball Grid Array configuration to printed circuit boards (PCBs). This paste achieve the desired electrical and mechanical connections without the associated health and environmental risks.

Environmental Compliance: This solder paste complies with global environmental standards making it safe for both manufacturers and end-users.

Thermal Performance: Despite having a higher melting point, BGA paste provides excellent thermal performance and stability, essential for high-reliability applications like smartphone repair.