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HomePhones & TabletsMobile Phone AccessoriesAccessory Combo PacksHigh Quanlity Ic Bga Reballing Solder Template Stencil Chipset For Samsung Exynos9810 /8895/7880/7580//7570/3470/3475/cpu
Shipped from abroad
High Quanlity Ic Bga Reballing Solder Template Stencil Chipset For Samsung Exynos9810 /8895/7880/7580//7570/3470/3475/cpu
KSh 3,052
KSh 5,18841%
In stock
+ shipping from KSh 283 to CBD - UON/Globe/Koja/River Road
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Shipped from abroad
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Pickup Station
Delivery Fees KSh 283
Ready for pickup between 29 June & 03 July when you order within next 15hrs 3mins
Door Delivery
Delivery Fees KSh 343
Ready for delivery between 29 June & 03 July when you order within next 15hrs 3mins
Return Policy
Easy Return, Quick Refund.Details
Seller Information
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Product details
- Origin:Cn(origin)
- Certification:Ce
Specifications
Key Features
- Origin:Cn(origin)
- Certification:Ce
What’s in the box
1*Mobile phone circuit accessories
Specifications
- SKU: GE840EA4DVFL6NAFAMZ
- Model: sjpeijian-98451
- Production Country: China
- Size (L x W x H cm): N/A
- Weight (kg): 0.6
- Main Material: plastic material
- From the Manufacturer: Prohibit high temperature exposure
- Shop Type: Jumia Mall
- Warranty Address: N/A
- Warranty Type: Repair by Vendor
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High Quanlity Ic Bga Reballing Solder Template Stencil Chipset For Samsung Exynos9810 /8895/7880/7580//7570/3470/3475/cpu
KSh 3,052
KSh 5,18841%
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